Huawei Unveils 1.4nm Process Technology and LogicFolding Architecture
Huawei announced its new LogicFolding architecture and 1.4nm process technology at the IEEE International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai. The technology aims to overcome US sanctions by replacing traditional physical scaling with time-based logic folding.
Huawei took the stage at the IEEE International Symposium on Circuits and Systems (ISCAS 2026) in Shanghai to unveil its latest semiconductor innovation. He Tingbo, head of Huawei's semiconductor business unit, presented the company's new LogicFolding architecture to a global audience. The announcement marks a strategic shift for the Chinese tech giant, which has been cut off from major foundries like TSMC due to US sanctions.
The LogicFolding architecture represents a departure from conventional chip design methods. Instead of relying on physical miniaturization to increase transistor density, Huawei's approach uses time-based folding to achieve higher performance. This technique allows multiple logic operations to be executed in the same physical area over different time slices, effectively multiplying computational capacity without shrinking transistor dimensions.
Huawei claims the new architecture enables a 1.4nm equivalent process node. The company did not disclose specific performance metrics or power efficiency figures during the presentation. However, He Tingbo emphasized that LogicFolding is designed to work with existing mature manufacturing processes, potentially bypassing the need for advanced EUV lithography equipment that is restricted under US export controls.
The announcement comes as Huawei continues to face severe restrictions on accessing cutting-edge semiconductor manufacturing technology. Since being added to the US Entity List in 2019, the company has been unable to purchase chips from TSMC or other foundries using American equipment. Huawei has since focused on developing its own chip design capabilities and working with domestic Chinese foundries.
Industry analysts note that while LogicFolding could offer a path forward for Huawei, the technology faces significant challenges. Time-based computing introduces latency and synchronization issues that must be addressed for practical applications. Huawei has not provided a timeline for commercial deployment of the 1.4nm process or LogicFolding architecture.
Huawei's semiconductor unit has been developing alternative chip technologies since the sanctions took effect. The company previously introduced its Kunpeng server processors and Ascend AI accelerators, which are manufactured using older process nodes. The LogicFolding architecture could potentially be applied to future generations of these products.
The ISCAS 2026 presentation did not include specific product announcements or partnerships. Huawei stated that the technology is still in the research phase and that further development is required before mass production. The company plans to publish detailed technical papers on LogicFolding in the coming months.
He Tingbo concluded the presentation by stating that Huawei remains committed to semiconductor innovation despite external challenges. The company will continue to invest in alternative architectures and manufacturing techniques to maintain its competitive position in the smartphone and AI markets.
Huawei Targets 1.4nm Chips Within Five Years, Defying US Sanctions
Huawei announced plans to develop chips with 1.4nm-class transistor density within the next five years. The company aims to advance its Kirin processors despite ongoing US sanctions.
Huawei has set a goal to produce chips with 1.4nm-class transistor density within the next five years, the company announced. The target represents a significant leap in semiconductor technology, placing Huawei in direct competition with industry leaders like TSMC and Samsung. The announcement comes as the Chinese tech giant continues to operate under strict US export controls that limit its access to advanced chipmaking equipment.
The company plans to achieve this milestone through its own research and development efforts, leveraging its HiSilicon semiconductor division. Huawei's Kirin processors, which power its flagship smartphones, are expected to benefit from this advancement. The 1.4nm node would enable higher performance and energy efficiency compared to current 5nm and 3nm chips used in modern devices.
Huawei's chip ambitions face substantial hurdles due to US sanctions imposed since 2019, which restrict the company from purchasing advanced chips and equipment from American suppliers. Despite these restrictions, Huawei has continued to develop its own chip designs and manufacturing capabilities. The company recently introduced the Kirin 9000S processor, built using an advanced 7nm process, which surprised industry observers.
The 1.4nm target aligns with industry roadmaps from leading foundries. TSMC has announced plans for 1.4nm production by 2028, while Samsung aims for 1.4nm by 2027. Huawei's timeline suggests it intends to match or approach these industry leaders, though achieving this without access to extreme ultraviolet lithography machines from Dutch firm ASML remains a major challenge.
Huawei's chip development strategy includes exploring alternative technologies such as chip stacking and advanced packaging to improve performance without relying solely on transistor miniaturization. The company has also invested in domestic Chinese semiconductor supply chains to reduce dependence on foreign technology. These efforts are part of China's broader push for semiconductor self-sufficiency.
The announcement was made during a company event where Huawei also showcased its latest Kirin 9000S processor, which powers the Mate 60 series smartphones. The Kirin 9000S has been praised for its performance and efficiency, despite being manufactured using a 7nm process. Huawei claims the new chip offers competitive performance against current flagship processors from Qualcomm and Apple.
Huawei's Kirin processors are used exclusively in its own devices, including smartphones, tablets, and laptops. The company has not announced plans to sell its chips to other manufacturers. The success of the 1.4nm project will depend on Huawei's ability to secure necessary equipment and materials, as well as its progress in developing alternative manufacturing techniques.
Huawei did not provide a specific release date for the 1.4nm chips but stated that the goal is to achieve this within five years. The company emphasized that its chip development remains on track despite external challenges. Huawei's continued investment in semiconductor technology underscores its commitment to maintaining a competitive edge in the global tech market.
US quantum computing investments face legality questions from Congress
The US government announced $2 billion in quantum computing investments, but a Congress member argues the deals are illegal as funds were allocated for semiconductor research. The largest investment would create a new company, Anderon, backed by IBM and the government.
The US government last week unveiled a $2 billion investment package for quantum computing companies, with $100 million allocated to each of several startups in exchange for equity stakes. These investments could prove critical for firms that remain years away from commercializing widely used products. However, a member of the US Congress has raised concerns that the deals may violate the law, arguing that the funds were originally designated for public semiconductor research rather than quantum computing ventures.
Representative Zoe Lofgren (D-Calif.), the ranking member of the House Science, Space, and Technology Committee, expressed dissatisfaction with the government's use of taxpayer money to support quantum technology. She contends that Congress did not authorize spending for this purpose, questioning the legality of the transactions. The largest portion of the investment is slated for a newly formed company called Anderon, which would receive $1 billion each from IBM and the government.
Anderon is set to inherit personnel and intellectual property from IBM, positioning itself as a foundry for fabricating quantum processing units. The company would contract its services to IBM and other firms seeking access to cutting-edge quantum hardware. The government's backing appears essential for Anderon's existence, as the company likely would not have been formed without this support.
The controversy highlights tensions between executive branch initiatives and congressional oversight over budget allocations. Lofgren's objections suggest potential legal challenges ahead, though no formal action has been taken. The quantum computing industry, still in its early stages, relies heavily on government funding to bridge the gap between research and commercial viability.
Proponents of the investments argue that quantum computing represents a strategic national priority, requiring substantial public-private partnerships to maintain US competitiveness. Critics, however, question whether the government is overstepping its authority by redirecting funds without explicit legislative approval.
The $2 billion package is part of broader efforts to bolster US leadership in emerging technologies, including artificial intelligence and advanced semiconductors. The quantum computing sector has attracted significant federal interest, with previous allocations through the National Quantum Initiative Act.
Lofgren has not indicated whether she will pursue legislative or legal remedies, but her public statements signal potential oversight hearings. The White House and Department of Energy, which oversee the investments, have not commented on the legality concerns.
Anderon's formation is expected to proceed pending final agreements, with operations slated to begin within the next year. The company aims to provide open-access quantum fabrication services, a model that could accelerate development across the industry. However, the unresolved legal questions may cast a shadow over its launch.
Alienware launches entry-level gaming laptop starting at $1,299
Alienware has introduced its most affordable gaming laptop, the Alienware 15, with prices starting at $1,299 for AMD configurations and $1,349 for Intel models. The new laptop aims to make the brand's premium gaming experience more accessible.
Alienware has unveiled a new entry-level gaming laptop, the Alienware 15, with a starting price of $1,299. The device is available in two configurations: one powered by an AMD processor and another with an Intel chip, priced at $1,349. This marks the company's most affordable gaming laptop to date, broadening its reach to a wider audience.
The Alienware 15 features a 15.6-inch display with options for 1080p or 4K resolution. Buyers can choose between AMD Ryzen 5000 H-series or Intel 11th Gen H-series processors, paired with NVIDIA GeForce RTX 30-series graphics. Memory options range from 8GB to 32GB of DDR4 RAM, and storage includes up to 1TB SSD.
The laptop's design incorporates Alienware's signature Legend 2.0 aesthetic, with a dark side of the moon color scheme. It includes a full-size keyboard with per-key RGB lighting and a 720p webcam. The chassis is made of magnesium alloy and plastic, keeping weight at around 5.5 pounds.
Connectivity options include two USB 3.2 Gen 1 ports, one USB 3.2 Gen 2 port, one Thunderbolt 4 port (on Intel models), HDMI 2.1, a mini DisplayPort, an Ethernet jack, and a headphone/microphone combo jack. The laptop also supports Wi-Fi 6 and Bluetooth 5.2.
Alienware claims the laptop's battery lasts up to 8 hours on a single charge, though real-world usage may vary. The device uses a 180W or 240W power adapter depending on the configuration. The cooling system employs dual fans and four heat pipes to manage thermal performance.
The Alienware 15 is available for preorder starting today on Dell's website. The AMD model starts at $1,299, while the Intel version begins at $1,349. Both configurations are expected to ship in early February. This launch positions Alienware to compete with other budget gaming laptops from brands like ASUS and MSI.
Dell launches 14S and 16S laptops as successors to Plus lineup
Dell has introduced the 14S and 16S laptops, replacing its previous Plus models. The devices are now available with prices starting at $1,270.
Dell has unveiled the 14S and 16S laptops, which serve as the direct replacements for its earlier Plus series. The new models are now available for purchase, with pricing beginning at $1,270. These laptops target users seeking a balance between performance and portability.
The 14S features a 14-inch display, while the 16S comes with a 16-inch screen. Both models are equipped with Intel's latest processors and offer options for discrete graphics. Dell has focused on improving thermal management and battery life in these iterations.
Key specifications include up to 32GB of RAM and 1TB of SSD storage. The laptops also feature a full HD webcam with a privacy shutter and dual-array microphones. Connectivity options include Thunderbolt 4 ports, USB-A, HDMI, and a headphone jack.
Dell has redesigned the chassis for a more premium feel, with a magnesium alloy construction. The 14S weighs approximately 3.2 pounds, while the 16S comes in at around 4.1 pounds. Both models support Wi-Fi 6E and Bluetooth 5.2.
The 14S and 16S are aimed at professionals and students who need reliable performance for productivity tasks. Dell positions them as versatile machines suitable for both work and entertainment. The company has also emphasized sustainability, using recycled materials in the packaging.
Pricing for the Dell 14S starts at $1,270, while the 16S begins at $1,370. Both models are available now through Dell's official website and select retailers. Customers can configure the laptops with various processor, memory, and storage options.
Dell has not announced any immediate plans for additional configurations or regional availability beyond the initial launch. The company expects the 14S and 16S to appeal to users upgrading from older Dell models or seeking a modern alternative to the Plus series.